Tb20110 Thermal Bimetal Ribbon

• Product Type: Strip
• Material: FeMn
• Carbon Content: Low Carbon
• PCD: -
• Grade: Tb20110
• High Expansion Layer: Mn75ni15cu10
• Model NO.: TB20110
• Low Expansion Layer: Ni36
• Density: 7.7
• Electrical Resistivity at 20 C: 1.13
• Thermal Conductivity: 6
• Width: 5~120mm
• Thickness: 0.1mm
• Sample: Free
• Surface: Bright
• Packing: Standard
• Transport Package: The Wooden Case
• Specification: discuss
• Trademark: HUONA
• Origin: Shanghai
• HS Code: 72269990
• Production Capacity: 500 Ton/Month

Product Description

TB20110 Thermal Bimetal Ribbon

Common Name: Truflex P675R, Chace 7500,Telcon200
Bimetallic TB20110 holds very high thermal sensitivity and higher resistivity,but the modulus of elasticity and allowable stress is lower,it can improve the sensitivity of the instrument,decrease the size and increase the force.
 
Composition

Grade	TB20110
High expansion layer	Mn75Ni15Cu10
Low expansion layer	Ni36

 
Chemical composition(%)
 

Grade	C	Si	Mn	P	S	Ni	Cr	Cu	Fe
Ni36	≤0.05	≤0.3	≤0.6	≤0.02	≤0.02	35~37	-	-	Bal.

 

Grade	C	Si	Mn	P	S	Ni	Cr	Cu	Fe
Mn72Ni10Cu18	≤0.05	≤0.5	Bal.	≤0.02	≤0.02	9~11	-	17~19	≤0.8

Typical Physical properties

Density (g/cm3)	7.7
Electrical resistivity at 20ºC(ohm mm^2/m)	1.13 ±5%
Thermal conductivity, λ/ W/(m*ºC)	6
Elastic Modulus,  E/ Gpa	113~142
Bending K / 10^-6 ºC^-1(20~135ºC)	20.8
Temperature bending rate  F/(20~130ºC)10^-6ºC^-1	39.0%±5%
Allowable temperature (ºC)	-70~ 200
Linear temperature (ºC)	-20~ 150

Application: The material is mainly used as Non magnetic non matching ceramic sealing material in Gyro and other electric vacuum devices.

Style of supply

Alloys Name	Type	Dimension
TB20110	Strip	W= 5~120mm	T= 0.1mm