Telcon200 Thermal Bimetal strip
Common Name: Truflex P675R, Chace 7500,Telcon200, Kan 200)
Bimetallic 108sp holds very high thermal sensitivity and higher resistivity,but the modulus of elasticity and allowable stress is lower,it can improve the sensitivity of the instrument,decrease the size and increase the force.
Composition
Grade |
Telcon200 |
High expansion layer |
Mn75Ni15Cu10 |
Low expansion layer |
Ni36 |
Chemical composition(%)
Grade |
C |
Si |
Mn |
P |
S |
Ni |
Cr |
Cu |
Fe |
Ni36 |
≤0.05 |
≤0.3 |
≤0.6 |
≤0.02 |
≤0.02 |
35~37 |
- |
- |
Bal. |
Grade |
C |
Si |
Mn |
P |
S |
Ni |
Cr |
Cu |
Fe |
Mn72Ni10Cu18 |
≤0.05 |
≤0.5 |
Bal. |
≤0.02 |
≤0.02 |
9~11 |
- |
17~19 |
≤0.8 |
Typical Physical properties
Density (g/cm3) |
7.7 |
Electrical resistivity at 20ºC(ohm mm2/m) |
1.13 ±5% |
Thermal conductivity, λ/ W/(m*ºC) |
6 |
Elastic Modulus, E/ Gpa |
113~142 |
Bending K / 10-6 ºC-1(20~135ºC) |
20.8 |
Temperature bending rate F/(20~130ºC)10-6ºC-1 |
39.0%±5% |
Allowable temperature (ºC) |
-70~ 200 |
Linear temperature (ºC) |
-20~ 150 |
Application: The material is mainly used as Non magnetic non matching ceramic sealing material in Gyro and other electric vacuum devices.
Style of supply
Alloys Name |
Type |
Dimension |
Telcon200 |
Strip |
W= 5~120mm |
T= 0.1mm |