Tb20110 Thermostatic Bimetal Strip for Micro Circuit Breaker

• Customization: Available
• Product Type: Strip
• Material: FeMn
• Model NO.: 5j20110
• PCD: -
• ET: -
• Hole: -
• OEM: Yes
• Sample: Free
• Stock: Seyn
• Transport Package: The Wooden Case
• Specification: discuss
• Trademark: HUONA
• Origin: Shanghai
• HS Code: 72255050
• Production Capacity: 500 Ton/Month

Product Description

TB20110 Thermostatic Bimetal Strip for Micro Circuit Breaker

Common Name: Truflex P675R, Chace 7500,Telcon200,  5J11 )
Bimetallic 108sp holds very high thermal sensitivity and higher resistivity,but the modulus of elasticity and allowable stress is lower,it can improve the sensitivity of the instrument,decrease the size and increase the force.
 

Chace 7500 Thermostatic Bimetal Strip is used to convert a temperature change into mechanical displacement. The strip consists of two strips of different metals which expand at different rates as they are heated, usually steel and copper, or in some cases steel and brass. The strips are joined together throughout their length by riveting, brazing or welding. The different expansions force the flat strip to bend one way if heated, and in the opposite direction if cooled below its initial temperature. The metal with the higher coefficient of thermal expansion is on the outer side of the curve when the strip is heated and on the inner side when cooled.
Bright Surface Stamping Bimetallic Strip Mn75Ni15Cu10 For Thermostat Elements

Bimetal Strip Telcon 200 for Coffee heater switch

Telcon 200 (Bimetallic strip)

(Common Name: 108SP / Telcon 200 / P675R / 5J11 / Chace 7500 Thermostatic Bimetal Strip)

The sideways displacement of the strip is much larger than the small lengthways expansion in either of the two metals. This effect is used in a range of mechanical and electrical devices. In some applications the bimetal strip is used in the flat form. In others, it is wrapped into a coil for compactness. The greater length of the coiled version gives improved sensitivity.

Chemical composition(%)

Grade	C	Si	Mn	P	S	Ni	Cr	Cu	Fe
Ni36	≤0.05	≤0.3	≤0.6	≤0.02	≤0.02	35~37	-	-	Bal.

 

Grade	C	Si	Mn	P	S	Ni	Cr	Cu	Fe
Mn75Ni15Cu10	≤0.05	≤0.5	Bal.	≤0.02	≤0.02	14~16	-	9~11	≤0.8

Composition

Grade	Telcon 200
High expansion layer	Mn75Ni15Cu10
Low expansion layer	Ni36

Typical Physical properties

Density (g/cm3)	7.7
Electrical resistivity at 20ºC(OMmm^2/m)	1.13 ±5%
Thermal conductivity, λ/ W/(m*ºC)	6
Elastic Modulus, E/ Gpa	113~142
Bending K / 10^-6 ºC^-1(20~135ºC)	20.8
Temperature bending rate F/(20~130ºC)10^-6ºC^-1	39.0%±5%
Allowable temperature (ºC)	-70~ 200
Linear temperature (ºC)	-20~ 150

Application: The material is mainly in automatic control devices and instrumentation (eg: exhaust thermometers, thermostats, voltage regulators, temperature relay, automatic protection switching, diaphragm meters, etc.) make temperature control, temperature compensation, current limit, temperature indicator and other heat-sensitive components.

Feature: The basic characteristics of Thermostat Bimetallic is bending deformation with temperature changes, resulting in a certain moment.
Thermostat Bimetallic Strip expansion coefficient is different from the two or more layers of metal or alloy along the entire contact surface firmly bonded, having a temperature-dependent shape change occurs thermosensitive functional composites. Wherein the higher expansion coefficient of the active layer is a layer called a low coefficient of expansion of the layer is named passive layer.