Customization: | Available |
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Product Type: | Strip |
Material: | FeMn |
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Bimetal Strip Telcon 200 for Coffee heater switch
Telcon 200 (Bimetallic strip)
(Common Name: 108SP / Telcon 200 / P675R / 5J11 / Chace 7500 Thermostatic Bimetal Strip)
The sideways displacement of the strip is much larger than the small lengthways expansion in either of the two metals. This effect is used in a range of mechanical and electrical devices. In some applications, the bimetal strip is used in the flat form. In others, it is wrapped into a coil for compactness. The greater length of the coiled version gives improved sensitivity.
Chemical composition(%)
Grade | C | Si | Mn | P | S | Ni | Cr | Cu | Fe |
Ni36 | ≤0.05 | ≤0.3 | ≤0.6 | ≤0.02 | ≤0.02 | 35~37 | - | - | Bal. |
Grade | C | Si | Mn | P | S | Ni | Cr | Cu | Fe |
Mn75Ni15Cu10 | ≤0.05 | ≤0.5 | Bal. | ≤0.02 | ≤0.02 | 14~16 | - | 9~11 | ≤0.8 |
Composition
Grade | Telcon 200 |
High expansion layer | Mn75Ni15Cu10 |
Low expansion layer | Ni36 |
Typical Physical properties
Density (g/cm3) | 7.7 |
Electrical resistivity at 20ºC(OMmm2/m) | 1.13 ±5% |
Thermal conductivity, λ/ W/(m*ºC) | 6 |
Elastic Modulus, E/ Gpa | 113~142 |
Bending K / 10-6 ºC-1(20~135ºC) | 20.8 |
Temperature bending rate F/(20~130ºC)10-6ºC-1 | 39.0%±5% |
Allowable temperature (ºC) | -70~ 200 |
Linear temperature (ºC) | -20~ 150 |
Application: The material is mainly in automatic control devices and instrumentation (eg: exhaust thermometers, thermostats, voltage regulators, temperature relay, automatic protection switching, diaphragm meters, etc.) to make temperature control, temperature compensation, current limit, temperature indicator, and other heat-sensitive components.
Feature: The basic characteristic of Thermostat Bimetallic is bending deformation with temperature changes, resulting in a certain moment.
Thermostat Bimetallic Strip expansion coefficient is different from the two or more layers of metal or alloy along the entire contact surface firmly bonded, having a temperature-dependent shape change occurs thermosensitive functional composites. Wherein the higher expansion coefficient of the active layer is a layer called a low coefficient of expansion of the layer is named passive layer.