High Purity 99.9% Min. Tin and Nickel Plated Copper Strip

Product Description

Cu%99.90 C11000 Cu ETP
Min thickness:0.001mm
little order can accept
Specification of red copper strip we supply:
Strip: thick:0.15-3.0mm width:610mm
Plate:thick:0.5-3mm width:610mm Length:2500mm

Chemical Content, %

Cu

Bi

Sb

As

Fe

Ni

Pb

S

Zn

ROHS Directive

Cd

Pb

Hg

Cr

99.90

0.001

0.002

0.002

0.005

-

0.005

0.005

-

ND

ND

ND

ND

 
Physical Properties

Melting Point - Liquidus	1083ºC
Melting Point - Solidus	1065ºC
Density	8.91 gm/cm^3@ 20 ºC
Specific Gravity	8.91
Electrical Resistivity	1.71 microhm-cm @ 20 ºC
Electrical Conductivity**	0.591 MegaSiemens/cm @ 20 ºC
Thermal Conductivity	391.1 W/m ·^oK at 20 C
Coefficient of Thermal Expansion	16.9 ·10-6perºC(20-100 ºC)
Coefficient of Thermal Expansion	17.3 ·10-6perºC(20-200 ºC)
Specific Heat Capacity	393.5 J/kg ·^oK at 293 K
Modulus of Elasticity in Tension	117000 Mpa
Modulus of Rigidity	44130 Mpa

 
With the assistance of our advanced technology, we offer quality range of Copper Strips and Plate. Manufactured using finest grade of raw material our array is widely used in numerous industries for excellent finish, corrosion resistance and durability. We even custom design these strips and flats as per client specific requirement.

Quality ltems		General Technical Terms
		1/3 OZ/ft 2 (12μ m)	1/2 OZ/ft 2 (18μ m)	3/4OZ/ft 2 25μ m	1 OZ/ft 2 35μ m	7/5 OZ/ft 2 (1.4μ m)	2 OZ/ft 2 (70μ m)
Area Weight(g/)		102-112	153	230	305	435	610
Tensile Strenght(kg/mm 2)	STD-E	≥ 205	≥ 205	≥ 235	≥ 275	≥ 275	≥ 275
	HD-E	≥ 17	≥ 103	≥ 156	≥ 205	≥ 205	≥ 205
Elongation(%)	STD-E	≥ 2	≥ 205	≥ 3	≥ 3	≥ 3	≥ 3
	HD-E	≥ 2	≥ 2.5	≥ 3	≥ 3	≥ 5	≥ 5
Surface Roughness(μ m)	Shiny Surface Ra	≤ 0.43	≤ 0.43	≤ 0.43	≤ 0.43	≤ 0.43	≤ 0.43
	Matte Surface Rz	5	6	10	10	12	12
Peel Strength(Kg/cm)		≥ 1.1	≥ 1.2	≥ 1.8	≥ 1.8	≥ 2.1	≥ 2.1
Leakage Poins(points/)		≤ 5			No
High Temperature Anti-Oxidization Performance		Treat in the 200 constant temperature for 60 minutes, there is no oxidation stain

Application of Copper foil
1) Electric and electricsprings,switches
2) Lead frames
3) Connectors and oscillation reeds
3)PCB field
4) Communication cable, Cable armoring, Mobile phone mainboard
5) Ion battery production lamination with PI film
6) PCB collector(electrode backing) materials