Invar New Material Advanced Opto-Electronic Packages Kovar Baseplate

Product Details
Customization: Available
Type: Electronic Packages
Material: Fe Ni Alloy
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Management System Certification
ISO 9001, ISO 9000, ISO 14001, ISO 14000, QC 080000
OEM/ODM Availability
Yes
  • Invar New Material Advanced Opto-Electronic Packages Kovar Baseplate
  • Invar New Material Advanced Opto-Electronic Packages Kovar Baseplate
  • Invar New Material Advanced Opto-Electronic Packages Kovar Baseplate
  • Invar New Material Advanced Opto-Electronic Packages Kovar Baseplate
  • Invar New Material Advanced Opto-Electronic Packages Kovar Baseplate
  • Invar New Material Advanced Opto-Electronic Packages Kovar Baseplate
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Basic Info.

Model NO.
Electronic Packages
Application
Conduct Electricity, Transmission of Electrical Signals, Photoelectric Communication
Character
Hermeticall Sealed
Species
Photoelectric Communication
Production Process
Cold Pressing
Shape
Customizable
Interface Type
Customizable
Certification
BS, UL, VDE
Brand
Huona
Sample
Free
Surface
Bright
MOQ
1000PCS
Grade
Invar,Kovar,Domet,4j36
Packing
Standard
Use
Hermetic Opto-Electronic Packages
Transport Package
Case
Specification
customizable
Trademark
HUONA
Origin
Shanghai
HS Code
8538900000
Production Capacity
50000 Pieces/Month

Product Description

Invar New Material Advanced Opto-Electronic Packages Kovar baseplate 
 
▪    Flatpack
▪    Plug-Ins Metal Package
 
We have an extensive range of Hermetic Opto-electronic packages.
 
High reliability, hermeticall sealed product in many configurations including standards--Flatpacks(butterfly style), Plug-ins(bathtub style), and plat-forms(dual-in-line style), and many other sophisticated metal composite packages. These packages are developed to hermetically encapsulate laser diode transmitter and receiver assemblies and other Opto-electronic circuits.
 
Products can be manufactured with matched glass-to metal seals or stripline ceramic inserts, utilizing materials ranging from ASTM F-15 to advanced thermal management materials to enhance and optimize device performance.
 
High quality products are made in conformance with and certified being compliant to MIL-PRF-38534.

Typical Opto Material Combinations

 
Base Material Base Conductivity W/m ~K CTE X 10-6/~C Density LBS/in 3 Ring Frame Material
ASTM F-15 14 4.9 .302 ASTM F-15
W/Cu 175 - 205 6.5 - 8.3 .535 - .611 Fe Ni Alloy
Mo/Cu 165 - 185 6.5 - 7.7 .357 - .361 Fe Ni Alloy
Mo 140 6.0 .408 ASTM F-15
Al/SiC 160 6.5 - 8.5 .107 - .110 Contact the factory

Huona has a depth of product range, from commercial and mil spec connectors and headers to microelectronic hermetic packages, TO's and battery seals, tantalum capacitors seals, and end seals.
 
we have the technology focus on doing what we do best: glass to metal and ceramic to metal sealing.
 
Manufactured bodies we using are standard materials - Cold Rolled Steel, Stainless Steel, Kovar…and exotic…Inconel, Monel, Molybdenum, and Titanium
Electrodes in 52 Alloy, Kovar, Stainless Steel, and Inconel; also Chromel/Alumel and Iron/Constantin for thermocouple applications

UNITARY HERMETIC INSULATING CROSSROADS

Technologies: Glass-Metal Sealing, Glass-Metal Sealing by Compression, Glass-Titanium Sealing and Ceramic-Metal Brazing

Materials (non-exhaustive list): Dilver P1 (Kovar), Iron Alloys Nickel, Stainless Steel, Titanium, Ceramic, Steel, Inconel, Copper

Fields of application: all the equipment to be protected in a hermetic enclosure: transformers, capacitors, relays, rectifiers, etc.

By way of example, hermetic insulating bushings in stainless steel or steel are used for environments subjected to pressure.

Specialist Hermetic Sealing Glass-Metal Brazing and for the medical, aerospace, nuclear, research
oil,  and industrial, Huona (Shanghai) New Material has developed in recent years by proposing assemblies Glass-Titanium and Ceramic-Metal.
Huona continues its policy of diversification and innovation in assembly and interconnection solutions, all of which these new products have enabled Huona to increase by 50% its turnover in the last two years (5M Euros including 20% export)
Product ranges offered Glass-Metal Classic Technology:
unit vias (Ø 0.7 mm to several mm), multipass (+ 1000), Tin plate shape, bowl, dish, fiber optical connectors, pigs, microwave beads, etc ...
Used materials:
Steel, stainless steel, DP1 (KOVAR), Titanium (T40, TA6V), molybdenum, Monel, Hastelloy B3, iron-nickel alloy, Inconel X750, steel MP35N, SB26 (Copper-Nickel-Silicon alloy), Platinum.
New technologies & new products:
- Brazing Metal-Ceramic (ceramic metallization by sputtering or thick layer), or Titanium Sapphire Brazing Quartz Titanium. [Ag / Cu used solder; Ag / Cu / Pd; Ag; Au / Cu; Au; Cu (780ºCto 1083 ºC).]
- Au / Sn Saphir-Kovar brazing.
- Glass-Titanium sealing (non-magnetic assembly).
We are designers and we meet your specific needs according to your specifications charges.

Specialist in Glass to Metal Hermetic Sealing, and Brazing for different applications such as medical, space, nuclear, oil exploration, and industry, Huona has grown these past years by providing glass to titanium and ceramic to metal assemblies.
These new solutions allow Huona to increase the turnover of around 50% for the last two years. (€ 5M including 20% export).
Glass sealing classic products:
Single lead (diameter: from 0.7mm to several millimeters.), Multi lead (more than 1000 pins), flat-form package, plug-in package, fat pack, optical package, connectors, connectors, microwave bead, etc ...
Raw material:
Steel, Stainless Steel, Kovar, Titanium, Molybdenum, Hastelloy B3, Copper-Nickel Alloy, Inconel, Iron-Nickel Alloy, Platinum.
New technologies & new products:
- Ceramic to Metal seal (metallization ceramic by sputtering or thin layer), sapphire or quartz metal seal. [Brazed used Ag / Cu; Ag / Cu / Pd; Ag; Au / Cu; Au; Cu (780ºC to 1083ºC).]
- Gold tin brazed Kovar-Sapphire.
- Glass to Titanium Seal.
Our R & D department design your product following your own specifications

Invar New Material Advanced Opto-Electronic Packages Kovar Baseplate


Invar New Material Advanced Opto-Electronic Packages Kovar Baseplate

Invar New Material Advanced Opto-Electronic Packages Kovar BaseplateInvar New Material Advanced Opto-Electronic Packages Kovar BaseplateInvar New Material Advanced Opto-Electronic Packages Kovar Baseplate
 

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